OS1805 Equivalent thermal conductive properties and equivalent elastic properties of chip connection built by Cu and Sn-Ag-Cu solder

Abstract

Equivalent material properties of thermal conductivity, Young's modulus, Shear modulus and Poisson's ratio for micro bump layers were estimated by FEM simulation. The chip connections were built by copper and Sn-Ag-Cu solder and the equivalent material properties showed anisotropy depend on the fine structure of materials in micro bump layer. Response surface of these equivalent material properties were made by using plan of experiment method. Equivalent material properties that are difficult to be derived by the mixing rule can be efficiently derived by using the response surface.