抄録
The change of the microtexture of the electroplated copper thin films was applied to the evaluation of the accumulative damage under random load. The micro texture of the electroplated copper thin film at the edges of micro slits formed in the film was found to change as a function of the amplitude of the applied cyclic loading. The life of the change was expressed by the modified Miner's law wlich is applied to the evaluation of the accumulated damage of materials under fatigue loads. Thus, it is possible to apply this method to the evaluation of the accumulated load
