M&M材料力学カンファレンス
Online ISSN : 2424-2845
セッションID: PS20
会議情報
PS20 半導体実装用微細バンプ強度物性の微細組織依存性
遠藤 史明鈴木 研三浦 英生
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会議録・要旨集 フリー

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抄録
Microtexture dependence of the strength of electroplated copper bumps used for fine interconnections in electronic packaging were investigated experimentally considering the effects of their electroplating conditions and heat treatment after the electroplating. Not only Young's modulus but also the strength of electroplated copper thin films changed drastically depending on the change of their micro texture, and these values were significantly different from conventional bulk copper.
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© 2012 一般社団法人 日本機械学会
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