抄録
A synchrotron radiation X-ray micro tomography system called SP-μCT developed in SPring-8 has high special resolution. However, in the SP-μCT observations, the specimens were restricted by a shape roughly 1 mm in diameter. In order to extend this size limitation, we tried to apply the two types of methods, incomplete CT and synchrotron radiation X-ray laminography, for evaluating the fatigue crack propagation process in the flip-chip solder bumps. The obtained incomplete CT and laminography images clearly show the cracks, voids, and the Ag_3Sn phase. In addition, the surface area of the same fatigue cracks was also measured, to quantify the crack propagation process. However, the surface area change measured by incomplete CT and laminography differed from the crack propagation results obtained by standard SP-μCT.
