Abstract
The creep and creep recovery behaviors under the stress-controlled subloop loading in TiNi shape memory alloy tape were investigated. The results obtained can be summarized as follows. (1) If stress is kept constant at the upper stress plateau after loading up to the stress-holding start strain under a constant stress rate, creep deformation occurs due to the spread of the stress-induced martensitic transformation (SIMT) process. (2) If stress is kept constant at the lower stress plateau after unloading down to the stress-holding start strain from the maximum strain under a constant stress rate, creep recovery deformation occurs due to the reverse transformation. (3) If the stress-holding start strain is large, the creep strain rate under constant stress is high and the maximum strain is large. The creep strain rate increases based on temperature increase due to the exothermic SIMT up to the stress-holding start strain.
