抄録
Basic deployment behavior of a functional component of a satellite in micro G and on the ground is discussed. We propose the deployable object using shape recovery behavior of a TiNi-shape memory alloy wire and fabricate that. The wire is placed in a circular arrangement of a round-cut film and then folded up. When the wire is heated above reverse transformation temperature, the object is deployed due to shape recovery force of the wire. In this paper, we present the detailed configuration of the object and the difference in the deployment behavior between in the micro G and on the ground.
