The through hole connects each layer and conducts electric signals to the layers of the printed circuit board. The irregular shape was occurred on printed circuit board due to that the through hole was created by drilling process. The printed circuit board was stacked structure of glass fiber rich layers and resin layers. The stress concentration was occurred on the irregular shape of through hole. In this study, inelastic thermal stress simulation was performed by using a large scale simulator ADVENTURECluster which was based on FEM to study fatigue strength around through hole of printed circuit board.
