主催: 一般社団法人 日本機械学会
会議名: 材料力学カンファレンス
開催日: 2016/10/08 - 2016/10/10
Lead free solder materials have been used wildly in electronic apparatuses. Solder joints are subjected to fatigue damage under thermal cyclic load. Many studies on fatigue damage have been done, and low-cycle fatigue tests were carried out at strain rate of 1×10-4/s～1×10-1/s by authors. On the other hand, it was known that creep damage is induced sometimes in solder joints due to the elastic follow-up phenomena and the interaction between fatigue damage and creep damage shortens the life of the solder joint. In this study, low-cycle fatigue tests were carried out at strain rate of asymmetric slow-fast wave. The fatigue mechanize was discussed from the view point of the creep-fatigue interaction or creep damage recovery.
