Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 08, 2016 - October 10, 2016
Pull-out tests were carried out for thin copper wires soldered to nickel rod by lead-free solder, and the bonding interface strength was examined. A large variation was observed in the maximum load of the pull-out tests while the load-displacement curves were similar in all tests. Since thecorrelation between the apparent bond length of solder and the maximum load was not clear, the actual bonded area was evaluated on the surface of each copper wire after the test using the Scanning Electron Microscope (SEM). The maximum load was correlated well with the actual bonded area, which shows that the pull-out strength can be evaluated by the actual bonded area.
