Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 08, 2016 - October 10, 2016
In recent years, phase change materials (PCMs) have attracted attention as a temperature regulator for electronic devices. Resin composite materials containing microencapsulated PCM (MPCM) are needed in order to secure the mass of PCM in thin mobile devices. The mechanical properties of resin composite materials containing MPCM have not been clear. In this study, tensile tests and finite element analysis of the MPCM/high density polyethylene (HDPE) composite material are conducted to investigate the effects of MPCM on the mechanical properties of the composite material. Four kinds of the test specimens, such as the mass fraction of MPCM 0% (pure HDPE), 10%, 30% and 50%, were prepared. Young’s modulus, fracture strength and fracture elongation of the specimen are discussed considering the interface strength of HDPE and the melamine resin capsule of MPCM.
