銅単結晶ナノ薄膜における疲労き裂発生

抄録

An in-situ FESEM fatigue crack initiation experiment of a 760-nm-thick freestanding single crystalline copper (Cu) film was conducted to clarify the intrinsic mechanisms of fatigue crack initiation excluding the effect of microstructure such as twin boundaries. An hourglass-shaped film specimen with a single-side-edge notch was prepared. The specimen had (001) surface and [110] loading direction. FESEM observations showed that slip lines were formed at the notch root in [110] direction perpendicular to the loading axis. Intrusions/extrusions were then formed along a single slip plane, or (111) plane, and a crack occurred along the slip plane.