マイクロ円環圧縮試験法によるSIC薄膜のはく離強度評価

抄録

In order to evaluate interfacial fracture toughness of hard films, a micro ring-compression method is newly proposed. Micro ring-compression test was carried out using a newly fabricated apparatus. SiC films with thicknesses of 1 and 2 μm was sputter coated on stailless steel rings as a specimen. The result showed that the curvature ot the specimen increased with increasing compression load, and delamination of the SiC film occured with further increasing load after plastic deformation of substrate. Scanning electron microscopic observation result showed that delamination of the SiC film occured at the interface. Obtained interfacial fracture toughness was in the range of 140-220J/m2, and increased with increaseing film thickness.