異材接合体強度に及ぼす界面端形状の影響

（接合処理温度依存性）

抄録

This study provides that effects of interface edge shape on bonding strength of ceramics to metal joint system with arc-shaped free surfaces. Each joint specimen, Si₃N₄ to Ni joint which was composed of silicon nitride as electro-conductive ceramic and the pure nickel, was bonded at 980°C in a furnace maintained vacuum condition. Relationship between bonding tensile strength and the edge shape was clarified experimentally. These experimental results were compared with our past results using the Si₃N₄ to Ni specimens bonded at 780°C and 880°C. It was clarified temperature dependence of optimum interface edge shape which the maximum bonding strength appears range over 780°C≦T≦980°C.