鉛フリーはんだ材の疲労寿命とひずみ波形

抄録

Lead free solder materials have been widely used for electric circuit boards. Solder joints subject to fatigue damage due to the temperature change and creep damage due to long term load derived by elastic follow-up phenomena. Strain is particularly concentrated on the solder joint and there is a possibility of disconnect by low cycle fatigue. In our previous, fatigue tests were carried out under different strain ratio for Sn-3.0Ag-0.5Cu. In this study, low cycle fatigue tests were carried out under different strain ratio and strain waveform and we discussed the effect of strain rate and strain waveform on fatigue life.