主催: 一般社団法人 日本機械学会
会議名: M&M2018 材料力学カンファレンス
開催日: 2018/12/22 - 2018/12/24
This paper describes the results of our numerical study of the electromechanical and thermoelectric responses in functionally graded piezocomposites (FGPCs) under mechanical load and temperature change. A finite element analysis (FEA) is employed to simulate the bending behavior by concentrated and cyclic loads and the deformation by temperature change of FGPCs. A phenomenological model considering the temperature dependence of piezoelectric constants and permittivity is used in the calculation, and the effects of property gradation on the deformation, internal stress and induced voltage of the FGPCs are examined.