抄録
Experiments of the ultrasonic die sinking of circular holes have been carried out on silicon carbide (SiC) workpiece by using various properties of slurry. Abrasive motion mechanisms were investigated by CCD camera and through SEM. It was observed that there arises an uncut part of the material at the center of the bottom of the machined hole on the workpiece. At the same time, the machining rate decreases due to the cavitations and due to the existence of the uncut part of the material, which grows up gradually as the machining advances. It is influenced by the various process parameters including the properties of slurry (viscosity, surface potential etc.).
