抄録
Abrasive jet machinig which is typically blasting is rough working as deburring and rough finishing. But otherwise it has been increasing that the materials used for semicondector, electronic devices and LCD parts are worked by micro abrasive jet machining, because it is a method of dry manufacturing and high productibity. According to their requests we have developed the micro abrasive jet machining equipment which is a blasting equipment used micro abrasives and is able to work hard and brittle materials for uses of uses of semiconductor, electronic devices and LCD parts in high accuracy. The micro abrasive jet machining equipment which is called MICROBLASTER has an abrasive feeder which is able to supply micro abrasives constantly. We introduce an outline of this equipment and machining characteristics of hard and brittle materials for microblasting technology in this report.
