抄録
Polishing of brittle material such as silicon wafer and glass disc has been conducted by using vesicant polyurethane pad which has worn with polishing of a workpiece. Polishing characteristics of a glass disc are influenced by a wear mode of the pad. Present paper focuses on finding of the relationship between wear of the pad and its visco-elastic property. Volume fraction wear of the pad is estimated with an optical microscopy and also visco-elastic property of the pad is measured with a balancing type measuring setup. It is found that the pad has gradually worn with polishing process, in which wear rate of the pad is dependent upon its visco-elastic property. Experimental data show that there is some relationship between wear mode of the pad and visco-elastic property of it. Finishing characteristics of the glass disc is closely related to wear mode of the pad.
