The Proceedings of The Manufacturing & Machine Tool Conference
Online ISSN : 2424-3094
2001.3
Session ID : 219
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219 Effect of Ultrasonic Vibration in Grinding of Sintered Diamond Tool
Tsuyoshi YokosawaMitsuru KodamaShinichi TanakaManabu YamazakiToru WaidaNorichika Hasegawa
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Abstract
We were successful in development of micro sintered diamond tool for ultrasonic machining by using cylindrical grinding with ultrasonic torsional vibration. The tool life is about 200 times as long as life of conventional tools. For the present, minimum size of developed micro tools is 0.09mm in diameter. For investigating the basic phenomena of ultrasonic grinding process, the experiments were carried out by observing surface of grinding wheels and work pieces on the grinding with /without ultrasonic vibration and by measuring grinding ratio. In the result,ultrasonic vibration plays important roles of mechanical cleaning effect to prevent loading of wheel and of reduction effect of wear of abrasive grain.
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© 2001 The Japan Society of Mechanical Engineers
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