生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
Online ISSN : 2424-3094
セッションID: 228
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228 YAGレーザ照射におけるセラミックスの加工特性(OS5 電子部品・光学部品の超精密加工)
吉田 武司庄司 克雄厨川 常元千葉 周一
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Since fine ceramics have excellent mechanical properties, they are used in a wide variety of structural parts. Laser machining of the fine ceramics is often accompanied by crack formation, which is produced by local thermal stress in the target due to a high temperature gradient. In this research, piercing in pulsed YAG laser irradiation was carried out for four kinds of normal sintered ceramics of size 3 mm in thickness. From the SEM observations of holes, the piercing process and the processing damage were investigated. The results obtained as follows. (1) The piercing time of oxide ceramics is less than non-oxide ceramics. Especially, the piercing of zirconia was carried out at 0.1 seconds or less. (2) For silicon carbide, the piercing time was long and the processing damage occurred easily.

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