Abstract
To examine the polishing characteristics of the Mn oxide slurry, in which abrasive grain itself is oxidizing agent, Chemical Mechanical Polishing (CMP) of copper surfaces has been carried out by using Mn_2O_3, MnO_2 and Al_2O_3 as an abrasive grain. As a result of comparison from the viewpoint of the stock removal and surface roughness, the best result is obtained in Mn_2O_3 slurry. Furthermore polished surfaces have been analyzed by means of Atomic Force Microscope (AFM). While many mechanical scratches are observed in the polished surface with Al_2O_3 slurry, the surface with Mn oxide slurry is covered with fine protrusions. It seems that the fine protrusions result from interaction between mechanical and chemical effects.
