抄録
Grinding performance of silicon wafer with fine abrasive grinding wheel were investigated. In this study, thin-plate-shaped silica powder, tens μm in length and 1μm in width, were applied as a abrasive for grinding wheel. The grinding wheel were fabricated using a electrophoretic deposition phenomenon, it was called EPD pellet, and thin-plate shaped silica abrasives could be arranged in a one-way direction in the EPD pellet. Grinding effciency of thin-plate shaped silica EPD pellet was twice as high as a conventional EPD pellet which was consist of spherical silica abrasive. Warp of thin-wafer, 150μm in thickness ground by diamond wheel, were decreased with the progress of EPD grinding. This result show that a residual strain by a diamond wheel could be removed by EPD grinding.
