抄録
A dicing blade is widely used for cutting of hard-brittle materials, such as crystal and a silicon wafer. Roughly classifying to the blade that is utilized generally, there are an electroplated metal bond blade and a resin bond blade. Compared with the metal bond blade, the resin bond blade has some merits such like the low consumption current value of the blade spindle motor during the processing and the high surface quality of the work-piece although the machining effciency falls a little. However, since the light curable resin blade did not have electro conductivity, the zero point detection function of the present machine was impossible for it. And then by adding with electro conductivity filler or resin, we developed a new electro conductive dicing blade.
