The Proceedings of The Manufacturing & Machine Tool Conference
Online ISSN : 2424-3094
2002.4
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Comparison of Machining Performances of MCP Abrasives for Si Wafer Polishing
Nobuo YASUNAGA
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 99-100

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Abstract
Usefulness of BaCO_3,CaCO_3,ZnO and Mica abrasive is found for super-smooth mechanochemical polishing of large size silicon wafers. Machining characteristics of these abrasives depend on material quality of the polishing plates and polishing conditions. This paper describes comparison of polishing performances of these 4 mechanochemical abrasives. These results would be very useful as the fundamental data for determining optimum polishing conditions required for machining needs like improvement of flatness, smoothness and machining efficiency.
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© 2002 The Japan Society of Mechanical Engineers
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