抄録
The aim of this paper is to propose a new finishing process for thin quartz wafers used for high frequency resonators. The process requires simultaneous improvement of surface roughness and parallelism with minimal material removal. Consequently, the process must be capable of both superfine finishing and localized material removal. The magnetic field assisted finishing process enables localized material removal through control of the magnetic field distribution at the finishing area, and mirror finishing is achieved using magneto-rheological fluid based slurry. Therefore, this paper proposes the application of magnetic field assisted finishing to the finishing of thin quartz wafers. It describes the processing principle and the development of the finishing equipment used to realize the principle. The finishing experiments demonstrate the feasibility of the proposed process for superfine finishing of thin quartz wafers with minimal material removal and minimal distortion of the surface shape.
