抄録
Micro chemically Ni-P plated diamond tools were developed and the crystal structure of plating layer was made clear. Drilling and grooving characteristics of single crystalline silicon and quartz glass were examined using these tools regarding machining mode, tool life, hole diameter change, product quality, etc. As a result, the tool life in grooving glass was almost an half of that in silicon, which may result from the thermal conductivity. In helical drilling of silicon more than 800 holes could be machined at the maximum.
