抄録
A high stiff rotary grinding machine for 450mm wafer has been designed and developed by the authors. The grinding machine is composed of a grinding-wheel spindle with a feeding function, water hydrostatic work table, and kinematic couplings which rigidly fix to the upper unit of the machine including the wheel spindle and the lower unit including the work table. The measured static stiffness of the work table was 1.61kN/μm when water-flow rate each bearing pad is at 10mL/min.
