The Proceedings of The Manufacturing & Machine Tool Conference
Online ISSN : 2424-3094
2016.11
Session ID : B31
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ダブルパルスレーザーによるワイドバンドギャップ半導体の光励起加工
[in Japanese][in Japanese][in Japanese][in Japanese][in Japanese]
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Abstract

The authors propose a novel surface processing method by using low fluence beam with photo excitation. A low power double pulse beam is controlled to generate the photo excited surface and to achieve the damageless processing on the surface. The pulse interval keep the duration within the time for deexcitation of the career in conduction band. In this paper, the fundamental experiments are performed to investigate the processing property for the photo excited surface as compared to femtosecond single pulse.

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© 2016 The Japan Society of Mechanical Engineers
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