The Proceedings of The Manufacturing & Machine Tool Conference
Online ISSN : 2424-3094
2019.13
Session ID : A29
Conference information

Monitoring of tool wear in turning with semiconductor strain sensor
*Kohei HONDAKatuhiko SAKAIHiroo SHIZUKARouji OKADAKentaro MIYAZIMA
Author information
CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Details
Abstract
Recently, fields such as IoT, Industry 4.0 are eliciting significant attention. In cutting process, tool breakage detection and wear monitoring techniques are important to optimize tool change timing. Generally, in production sites, which is a method to manage tools, the replacement timing is often managed based on certain pre-determined period of time or number of workpieces finished. Thus, the tools are replaced in much shorter period than their actual service time, thereby increasing the tool costs. In particular, in cutting of a high hardness material using a diamond tool, it is important to monitor the damage state of the tool from the viewpoint of processing cost and processing accuracy. From this, in this study, a semiconductor strain sensor developed for IoT technologies was applied to cutting of cemented carbide by using PCD tool with the aim of developing the low-cost and high-sensitivity tool wear detection technology. As a result, it was found that the cutting force can be measured, and the increasing of the cutting force due to tool wear during cutting can be detected.
Content from these authors
© 2019 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top