生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
Online ISSN : 2424-3094
セッションID: A29
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半導体ひずみセンサを用いた旋盤加工における工具摩耗状態のモニタリング
*本田 光平酒井 克彦静 弘生岡田 亮二宮嶋 健太郎
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Recently, fields such as IoT, Industry 4.0 are eliciting significant attention. In cutting process, tool breakage detection and wear monitoring techniques are important to optimize tool change timing. Generally, in production sites, which is a method to manage tools, the replacement timing is often managed based on certain pre-determined period of time or number of workpieces finished. Thus, the tools are replaced in much shorter period than their actual service time, thereby increasing the tool costs. In particular, in cutting of a high hardness material using a diamond tool, it is important to monitor the damage state of the tool from the viewpoint of processing cost and processing accuracy. From this, in this study, a semiconductor strain sensor developed for IoT technologies was applied to cutting of cemented carbide by using PCD tool with the aim of developing the low-cost and high-sensitivity tool wear detection technology. As a result, it was found that the cutting force can be measured, and the increasing of the cutting force due to tool wear during cutting can be detected.
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