生産加工・工作機械部門講演会 : 生産と加工に関する学術講演会
Online ISSN : 2424-3094
セッションID: A32
会議情報

半導体ひずみセンサによるドリル加工状態モニタリング手法の検討
*小澤 央季酒井 克彦静 弘生岡田 亮二宮嶋 健太郎
著者情報
会議録・要旨集 認証あり

詳細
抄録
Recently, data acquisition and utilization techniques in production site such as IOT and industry 4.0 have attracted attention. In the drilling process, in order to avoid the breakage of the tool and the decrease in the processing accuracy due to the progress of the tool wear, it is required to establish the monitoring technology of the processing state during the cutting process that can be used at the production site. From this, in this research, a semiconductor strain sensor developed for IOT applications was attached to the surface of the drill, and measured the strain generated in the drilling process by the cutting force in NC lathe and attempted to monitor the machining condition of the drill during machining. As a result, it was possible to detect the strain of the tool during drilling without reducing the rigidity of the tool using a strain sensor which is easy to install.
著者関連情報
© 2019 一般社団法人 日本機械学会
前の記事 次の記事
feedback
Top