抄録
Currently, the grind processing with a grindstone is commonly used for the removal processing of brittle materials including glass. However, this way is a direct contact processing by a grindstone. Therefore, it is difficult to process without micro cracks in the processing plane of glass. On the other hand, when a CO2 laser was scanned on the glass surface under certain conditions, there is a phenomenon that the mirror surface groove and the curled glass fragment were generated on the glass surface. Therefore, the purpose of our study is to clarify the mechanism of occurrence of this phenomenon in other to develop non-contact processing technology by laser with high removal efficiency. For that purpose, we experiment with a groove processing under the various conditions for slicing processing condition. Then, the stress intensity factor at the processing depth obtained the experiment was conducted by FEM, and the crack opening region was considered.
