Relationship between dwell time and removal height in RISA grinding

Abstract

RISA grinding method using cerium oxide slurry has been proposed for grinding optical glass lenses. While the surface quality can be maintained at high feed rate and depth of cut, there is a problem that the profile error increases toward the center of the workpiece. The workpiece is SSG and the grinding wheel is a resin diamond wheel. In this study, the relationship between dwell time and depth of cut is experimentally investigated, and dwell time control method is proposed to achieve a uniform depth of cut. This method changes the rotation speed of workpiece to keep the slurry dwell time constant regardless of the distance from the center of workpiece. The effectiveness of this method was evaluated through orbicular machining tests. With conventional RISA grinding, the grinding trace becomes deeper as it gets closer to the center of the workpiece. By using dwell time control, the depth of the grinding trace is almost the same regardless of the distance from the center.