抄録
A novel infrared (IR)-to-visible transducer thin film array made of Eu(TTA)_3-based temperature sensitive paint (TSP) for a thermal imaging device is proposed. A micro-fabricated thermal isolation structure of the TSP, of which the luminescence intensity changes with the temperature, is heated by incident IR light. Therefore, the power of IR light is converted to the intensity of luminescence. This optical read-out method does not need electric wiring for operation, which can minimize the heat loss. The temperature coefficient of the prepared TSP was about -1.58%/K, and the IR emitted from the observation object was successfully detected. The sensitivity of the device was about -0.01 %/K.
