ミニマルSi-DRIEの装置化と加工例

抄録

The expertise of SPP Technologies in plasma processing techniques has led to the company`s cooperation in the “minimal fab” concept proposed by AIST. A Bosch process deep silicon reactive ion etching process chamber has been developed. A plasma with similar properties to those generated in a mass-production process chamber has been realized in a minimal fab process chamber. Design and evaluation of the minimal process chamber was performed by plasma and radical characterization. Successful process results were achieved by generating a plasma with similar density and bias energy to that of a mass production chamber. SPP Technologies has achieved the first Si-DRIE minimal process chamber using the Bosch process. SPT's Minimal Si-DRIE chamber, a research platform aimed at IoT, AI, and other MEMS devices, can be expected to make a big impact due to its early release.