金属ナノ粒子の電界トラップを用いた厚い銅配線の自己修復の検討金属ナノ粒子の電界トラップを用いた厚い銅配線の自己修復の検討

抄録

This paper reports the repair of self-healing wiring using electric field traps in thick electrode and the change in resistance after repair. After self-repairing the copper wiring with artificial gap of 20 μm using gold nanoparticle dispersion, the resistance of the repaired portion was investigated. We successfully repair the electrode with thickness of 50 μm. Furthermore, there was no change in the wiring resistance due to the change in thickness. The possibility of applying self-healing wiring technology using electric field traps to the electrical cord was found to be able to repair thick wiring.