抄録
The interface layer was observed with theultrasonic method during bonding process. The experiment was performed at about 180 ℃ with a waveguide. The waveguide of 80 mm in length and 15 mm in diameter of waveguide was fixed between the ultrasound probe and the bonding material. A copper plate was used as substrate and the SnBi alloy as solder material.. The immersion method was applied in this experiment, with grease as medium. The ultrasound data was compared to the observed interface layer through the optical microscope. The analysis in frequency domain was also performed.
