The Proceedings of the Materials and processing conference
Online ISSN : 2424-287X
2004.12
Session ID : 523
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523 Effects of Sub-Interfacial Cracks on the Fracture Behavior of HIP Bonded Copper-Mild Steel Plates
Andrew WILLETTIsamu ODAMitsuharu YAMAMOTOYasuhide SOSOGI
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© 2004 The Japan Society of Mechanical Engineers
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