抄録
The more miniaturization is demanded from electronic parts as microelectronics develops, and the electric wire that composes them is thinner. However, there is a difficulty to connect electric wire and the terminal, because thin electric wire is breakable and melting easily. In these cases, such a joining method is effective as the plastic deformation is used and wrapped about the joint part on the terminal side by giving neither the transform nor heating such an electric wire, and to call this micro joining technology based on a new conception the micro mechanical joining method. In this paper, it was found that micro mechanical joining can fix the electric wire by plastic deformation experiment and FEM analysis.
