抄録
Diamond particle dispersed copper (Cu) matrix composites were fabricated from Cu-coated diamond particles by Spark Plasma Sintering (SPS) process, and their microstructures and thermal conductivities were examined. Cu-coated diamond particles were readily consolidated into composites at temperatures between 973K and 1173K. No reaction at the interface between the diamond particle and the Cu matrix was observed at the sintering temperature range applied in the present study. The relative packing density of the composite fabricated increased with increasing the sintering temperature and the holding time, and reached as high as 99.2% when sintered at 1173K for 2.1ks. Thermal conductivity of the composite including 43.2vol.% diamond particles attained 654W/mK, when the relative packing density of the composite was 99.2%. This value was about 83% of the thermal conductivity estimated by Maxwell-Eucken's equation.
