抄録
A microstructural study was performed on transient liquid phase (TLP) bonded Waspaloy superalloy with a Ni-Cr-B filler. The applicability of a diffusion model to determine the time required for complete isothermal solidification (tf) was investigated. Over the temperature range of 1065-1110℃ experimental observations of tf were in reasonable agreement with tf values predicted by the diffusion model. However, a notable deviation was observed in joints prepared between 1175 and 1225℃ in that the rate of isothermal solidification was reduced at these temperatures resulting in the formation of a centerline eutectic-type microconstituent, which in contrast, was prevented from forming after holding the brazing assembly for an equivalent bonding time at a lower temperature of 1145℃.
