リンク機構による高精度ダイセットの開発

抄録

To improve forming accuracy in press working, a new structure die-set with a link mechanism has been developed. The reduction rate by the link mechanism was set to 1/6. Annealed A1050 pure aluminum wires with a diameter of 1.0 mm was employed for workpiece. The wires were upset with flat dies. Dispersions of bottom dead point and thickness of formed workpieces were compared with by using die-sets with and without link mechanism. The dispersion of strokes of a servo press was about 10 μm, however, that of upper plate of the developed die-set was about 30 μm due to allowance. That of middle plate was about 6 μm and the dispersion was reduced. Difference between the objective thickness and thickness of formed wire without link mechanism was about 11μm, however, that with link mechanism was about 1 μm and the forming accuracy was improved. Dispersions of the thickness of formed wire with link mechanism became half of that without link mechanism.