3201 An SPC Approach to Quality Visualization for Factor Analysis in PCB Mounting Process
Details
In printed circuit board (PCB) mounting process using surface mount technology (SMT), automated optical inspection systems (AOI) are widely employed in order to guarantee the process quality such as volume of printed solder paste and size of soldered solder joint. However, a quality control method using the quality characteristics measured by AOI has not been established. We developed a statistical quality control (SPC) system which displays the variation of quality characteristics in a two dimensional color graph. It enables the analyzer to instantly narrow down the factors by recognizing the condition in which the quality anomaly occurs. We implemented the system to a PCB mounting factory and succeeded in reducing the cycle time of the process improvement and preventing soldering defect as a result.
