The Proceedings of OPTIS
Online ISSN : 2424-3019
2006.7
Session ID : 201
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201 The Thermal-Circuit Collaboration Layout Design of an Electronic System by the Intelligent Sub Design Module
Shintaro HayashiYoshiharu IwataRyohei SatohKozo Fujimoto
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Until now, the analysis method and the optimization method, which were used in design, were evolving independently. However, when designed combining them, coexistence of time and precision was difficult. Then, we have developed the high-speed first order design method. In this paper, we reconsidered optimization method for our design system. We applied agent-oriented optimization method for "heat conduction problem among devices". In a case study, we achieved more than 10% improvement in pareto curve. We also achieved about 90% shorter design time than former result of this study.
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© 2006 The Japan Society of Mechanical Engineers
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