Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : July 13, 2022 - July 14, 2022
Heat pipe is a simple heat transfer device widely used in microelectronics cooling. It has a capillary structure called wick on its inner wall to convey condensate from a heat release section to a heated section. Nanoparticle layer is extremely thin and has strong capillary force. Hence, it could be used as the wick of heat pipes or vapor chambers to contribute downsizing them. Also, it is known that silica particles can be used to form a nanoparticle layer on the pipe inner wall as the wick of the heat pipe. It can achieve better heat transfer performance than the normal heat pipe containing a screen mesh in it. In this research, three types of nanoparticles were used to form the nanoparticles layer in heat pipe. It was explored experimentaly how the the heat transport performance depends on the nanparticles construting the wick.
