抄録
In order to provide data relevant to an understanding of the relationship between the dynamic characteristics of a hot-film shear stress sensor and the thermal conductivity of the material under the sensor, 2D and 3D numerical simulations were carried out. From the results of 2D simulations, the values of shear stress were not able to be measured by the temperatures at higher Reynolds number since separated flow occurred. In 3D simulations, the sensor without a step was utilized. The heat transfer around a heater was analyzed.
