Proceedings of thermal engineering conference
Online ISSN : 2433-1317
2001
Session ID : OS-21/I/E207
Conference information
E207 Build-Up Approach for Thermal Design of Electronic Equipment : A JSME Project
Wataru NAKAYAMA
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
In order to expedite thermal design of electronic equipment a hierarchical organisation of the design work is proposed. In the knowledge development level, the computational fluid dynamics (CFD) simulation is performed on a set of template designs in the product development phase. From the solution body a fast-to-use design code will be developed for use in the actual design phase. This paper describes the basic concept, and illustrates the methods of knowledge extraction on some examples.
Content from these authors
© 2001 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top