Proceedings of thermal engineering conference
Online ISSN : 2433-1317
2001
Session ID : OS-21/I/E208
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E208 Flow and Heat Transfer around a Package of Electronic Equipment in Low-Speed Air Flow
Hajime NAKAMURATamotsu IGARASHI
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
An experimental study was preformed to investigate the flow and heat transfer around a thin square block, simulating a package of electronic equipment. The height and the side length of the block were H=2mm and c=45mm, respectively. The mean velocity of air in a rectangular duct, Um, ranged from 0.24 to 4 m/s, and the duct height, H_D, ranged from 3.8 to 10 mm. The temperature distribution on the block was measured by an infrared camera. From the result of the present investigation, it was found that the heat transfer distribution on the top face of the block can be predicted by the theory of laminar flat plate using the factor of U_m/β^2, where β is the opening ratio defined by β=(H_D-H)H_D. The average Nusselt number on the top face is formulated using the modified Reynolds number defined by Re_c^*=(U_m/β^2)c/v.
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© 2001 The Japan Society of Mechanical Engineers
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