Proceedings of thermal engineering conference
Online ISSN : 2433-1317
2002
Conference information
Effects of Rings on leveling the temperature distribution of wafers in quick heat up process (2)
Akeno MOCHIDAKazuhiko KUDOYukio HISHINUMAToshimitu MIYATA
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Pages 281-282

Details
Abstract
Considering the optical characteristics of silicone wafer, the transient radiative heat transfer analyses based on gray assumption were applied to rapid-heating process. The results show that regularity and transparency of wafer surface give a slight reduction in the wafer temperature distribution in one side.
Content from these authors
© 2002 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top