抄録
This study was performed for the purpose of investigating the influence of the swirl flow by an axial fan on finned LSI packages. The finned LSI sequence which imitated the package board has been arranged, and fin base temperature was measured. Moreover, the flow velocity of a fan down-stream part was measured. Numerical analysis of a fin sequence based on the measured flow velocity data was performed, and it was found that the calculated value is generally in agreement with a measured value.
